ZipRecruiter

Log In

1

Director Engineering Jobs in Encinitas, CA (NOW HIRING)

Concord Hospitality

Director of Engineering

San Diego, CA · On-site

$100K - $115K/yr

Description Concord Hospitality is seeking a skilled and proactive Chief Engineer to lead our property engineering team and ensure the safety, functionality, and quality of the hotel's infrastructure ...

Inversion

Director of Engineering, Manufacturing

Vista, CA · On-site

$175K - $244K/yr

We are seeking a Director of Engineering, Manufacturing to own all manufacturing at Inversion. This leader will be responsible for the full manufacturing ecosystem across the company - including ...

previous page

Showing results 41-60

All JobsEngineering JobsDirector Engineering JobsDirector Engineering Jobs in Encinitas, CA

Director Engineering information

See Encinitas, CA salary details

$78.4K

$209.1K

$272.8K

How much do director engineering jobs pay per year?

As of Sep 7, 2026, the average yearly pay for director engineering in Encinitas, CA is $209,135.00, according to ZipRecruiter salary data. Most workers in this role earn between $152,000.00 and $271,700.00 per year, depending on experience, location, and employer.

What are the most commonly searched types of Engineering jobs in Encinitas, CA?

The most popular types of Engineering jobs in Encinitas, CA are:

What job categories do people searching Director Engineering jobs in Encinitas, CA look for?

The top searched job categories for Director Engineering jobs in Encinitas, CA are:

What cities near Encinitas, CA are hiring for Director Engineering jobs?

Cities near Encinitas, CA with the most Director Engineering job openings:

Director Engineering jobs near you
Infographic showing various Director Engineering job openings in Encinitas, CA as of August 2026, with employment types broken down into 84% Full Time, 12% Part Time, 3% Contract, and 1% Nights. Highlights an 84% Physical, 5% Hybrid, and 11% Remote job distribution, with an average salary of $209,135 per year, or $100.5 per hour.

Director, IC Packaging Engineering - Mechanical Simulation

Qualcomm

San Diego, CA • On-site

$250/hr

Other

Re-posted 12 days ago

Qualcomm rating

8.8

Company rating: 8.8 out of 10

Based on 11 frontline employees who took The Breakroom Quiz

48th of 247 rated software companies

Job description

General Summary

This position is part of Qualcomm's Integrated Circuits (IC) Packaging organization and represents a senior leadership role within the Mechanical Simulation function. The Director will lead a team of engineers responsible for delivering FEA-based mechanical simulation solutions in support of Qualcomm's current and next-generation chipsets and advanced packaging technologies.

Core Technical Responsibilities

The Director will drive strategic alignment across IC package design/architecture, New Product Introduction (NPI), assembly, and Chip-Package Interaction (CPI) teams, ensuring high-quality mechanical simulation support across High Volume Manufacturing (HVM) and advanced packaging programs. Key responsibilities include:

  • Overseeing the development and validation of mechanical FEA models (ANSYS APDL).
  • Establishing BKM methodology for test correlation and material characterization.
  • Guiding stress/mechanical analysis for IC package designs, including warpage, solder joint reliability (SJR), package assembly process simulation, board level reliability (BLR), and chip-package-board interaction.
  • Championing innovation in simulation workflows, automation, and tooling to improve team efficiency and scalability.
  • Leading strategic initiatives to advance simulation methodology and best practices across cross-functional teams.
Minimum Qualifications
  • Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
  • Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
  • PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of System/Package Design/Technology Engineering or related work experience.
Preferred Qualifications
  • Ph.D. in Mechanical Engineering, Materials Science, Electrical/Microelectronics Engineering, or related field.
  • 12+ years of combined experience in finite element modeling and analysis for IC electronic packaging and interconnects.
  • 5+ years of direct people management, with experience managing managers or senior technical staff.
  • Proven track record of building and scaling high-performing simulation or engineering teams.
  • Deep expertise in IC electronic packaging structures, assembly processes, reliability testing and analysis, CPI, package-board interaction, and DOE.
  • Strong background in electronic packaging materials and thermo-mechanical behavior.
  • Experience establishing simulation BKMs, methodologies, and automation frameworks (e.g., APDL macros, OptiSLang, scripting/automation pipelines).
  • Experience with material testing for strength and fracture, including designing and executing mechanical test methods.
  • Demonstrated experience presenting technical roadmaps and simulation strategies to executive and customer audiences.
  • Publications or patents in FEA predictive modeling, warpage/SJR, and/or interfacial fracture testing (plus).
  • Experience working with external customers or partners in a technical liaison or program leadership capacity.
  • Excellent communication, influencing, and cross-functional collaboration skills.
  • Ability to manage competing priorities across multiple programs and business units.
  • Demonstrated ability to lead cross-functional technical programs and influence at senior levels.
Pay Range and Benefits

$227,300.00 - $340,900.00. The company also offers a competitive annual discretionary bonus program and opportunities for annual RSU grants.

EEO Statement

Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

#J-18808-Ljbffr

What Qualcomm employees say

Pay

Benefits

Hours and flexibility

Workplace

Get the full story on Breakroom

Qualcomm logo

About Qualcomm

Sourced by ZipRecruiter

Qualcomm is enabling a world where everyone and everything can be intelligently connected. You interact with products and technologies made possible by Qualcomm every day, including 5G-enabled smartphones that double as pro-level cameras and gaming devices, smarter vehicles and cities, and the technology behind the smart, connected factories that manufactured your latest purchase. Our powerful connectivity solutions keep you connected—even in remote areas. Qualcomm 5G and AI innovations are the power behind the connected intelligent edge. You’ll find our technologies behind and inside the innovations that deliver significant value across multiple industries and to billions of people every day.

Industry

Technology, communication and media

Company size

10,000+ Employees

Headquarters location

San Diego, CA, US

Year founded

1985

View All Qualcomm Jobs

Apply