1

Dicing Machine Operator Jobs (NOW HIRING)

$19.60/hr

Operating machinery including but not limited to; mixers, blenders, slicers, toasters, ovens ... Repetitive hand chopping, slicing, dicing, coring with knives and other hand tools for more than 30 ...

$19.60/hr

Operating machinery including but not limited to; mixers, blenders, slicers, toasters, ovens ... Repetitive hand chopping, slicing, dicing, coring with knives and other hand tools for more than 30 ...

Prep Cook

Los Angeles, CA ยท On-site

$19.60/hr

Operating machinery including but not limited to; mixers, blenders, slicers, toasters, ovens ... Repetitive hand chopping, slicing, dicing, coring with knives and other hand tools for more than 30 ...

Cook 2

Youngstown, OH ยท On-site

$16.75 - $20.75/hr

Slicing, dicing, chopping and prepare raw products. * Carving meats, portioning food on serving ... Operating and maintaining all equipment and utensils as required in accordance with established ...

Food Service Worker (Part Time)

Cherry Point, NC ยท On-site

$14.75 - $18/hr

As a qualified nonprofit agency operating within the AbilityOne program, ServiceSource hires ... Prepare food by paring, cutting, dicing, chopping, washing and/or cleaning vegetables and fruits ...

Magnolia Press - Barista

Waco, TX ยท On-site

$13.50 - $15.50/hr

Prepare ingredients for each recipe by chopping, dicing, slicing, washing, and using additional ... Proficiency in operating coffee machines and other equipment preferred. ELIGIBILITY QUALIFICATIONS

$15.25 - $18.75/hr

As a qualified nonprofit agency operating within the AbilityOne program, ServiceSource hires ... Prepare food by paring, cutting, dicing, chopping, washing and/or cleaning vegetables and fruits ...

Showing results 41-53

Dicing Machine Operator information

See salary details

$12

$18

$23

How much do dicing machine operator jobs pay per hour?

As of Sep 11, 2026, the average hourly pay for dicing machine operator in the United States is $18.19, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.47 per hour, depending on experience, location, and employer.

What is a dicing machine operator?

Dicing Machine Operators are skilled workers responsible for operating and maintaining machines that cut materials, such as semiconductor wafers, glass, or food products, into precise shapes and sizes. They set up the dicing equipment, monitor the cutting process, and ensure that the finished products meet quality and safety standards. These operators also perform routine machine maintenance and troubleshoot issues to minimize downtime. Attention to detail and adherence to safety protocols are crucial aspects of this role.

What are some common challenges faced by dicing machine operators, and how can they be addressed on the job?

Dicing Machine Operators often encounter challenges such as maintaining precise cuts, preventing machine downtime, and ensuring safety protocols are strictly followed. Variations in material hardness and thickness can require frequent adjustments and keen attention to detail. To address these challenges, operators should regularly inspect and calibrate their machines, communicate effectively with maintenance teams, and stay up-to-date on safety training. Collaborating with quality control staff also helps to promptly identify and correct any defects in the diced products.

What is the difference between Dicing Machine Operator vs Saw Operator?

AspectDicing Machine OperatorSaw Operator
CredentialsHigh school diploma, training on dicing equipmentHigh school diploma, training on saws and cutting tools
Work EnvironmentManufacturing, semiconductor, or electronics factoriesWoodworking, metal fabrication, or manufacturing plants
Industry UsageElectronics, semiconductor, food processingConstruction, woodworking, metalworking
Common Search/ComparisonYesYes

The Dicing Machine Operator and Saw Operator roles share similarities in working with cutting equipment and require related training. However, Dicing Machine Operators typically work in electronics or semiconductor manufacturing environments, focusing on precision cutting of wafers or materials, while Saw Operators are more common in woodworking or metal fabrication industries. Both roles involve operating specialized machinery and ensuring safety standards are met.

What states have the most Dicing Machine Operator jobs?

States with the most job openings for Dicing Machine Operator jobs include:

What are popular job titles related to Dicing Machine Operator jobs?

For Dicing Machine Operator jobs, the most frequently searched job titles are:

Infographic showing various Dicing Machine Operator job openings in the United States as of September 2026, with employment types broken down into 68% Full Time, 16% Contract, and 16% Nights. Highlights an 100% In-person job distribution, with an average salary of $37,827 per year, or $18.2 per hour.

Senior Wafer & FPA Process Engineer

Camarillo, CA โ€ข On-site

$106K - $137K/yr

Full-time

Re-posted 4 days ago


Job description

Safran DSI Business Unit: Attollo Engineering

ย 

ABOUT OUR MISSION:

Join the forefront of innovation and make an impact at Safran Defense & Space, Inc.!

Safran Defense & Space Inc. (Safran DSI), headquartered in Arlington, Va., is a leading U.S. aerospace company dedicated to supporting national defense and space missions. As a trusted partner to the U.S. armed forces, government agencies, and commercial sectors, Safran DSI delivers advanced technology solutions through its specialized business units: Assured PNT, Attollo Engineering, Geospatial AI, Optronics, Space Solutions, and Testing & Telemetry.

Attollo Engineering is a designer and manufacturer of cutting-edge infrared cameras and laser sensor systems for defense and industrial applications. Leveraging extensive expertise in the electro-optical market, systems design, and packaging, Attollo delivers superior solutions for system integrators, original equipment manufacturers, and custom applications. Their commitment to quality engineering empowers Safran DSI to provide innovative and reliable technology to its partners.

If you're ready to join our mission and serve those who serve, Safran DSI is the perfect place for you to take your career to the next level. Make a real difference and be part of something extraordinary. Apply now and help us build the future of defense and space.

ย 

POSITION PROFILE:

The Senior Wafer & FPA Process Engineer is responsible for the development, ownership, and continuous improvement of manufacturing processes - spanning R&D and Production - for III-V semiconductor materials (GaAs, InP, InGaAs, GaSb) used in infrared detector array fabrication, and for focal plane array (FPA) back-end processes including hybridization and substrate removal that convert detector arrays into finished sensor products. The role applies design of experiments (DOE) and statistical process control (SPC) methodologies to drive yield and reproducibility, and serves as a senior technical resource within the process engineering team, including mentorship of operators, technicians, and junior engineers.

RESPONSIBILITIES:

  • Develop and optimize wafer-level and FPA-level fabrication processes for infrared detectors and other optoelectronic devices
  • Develop semiconductor wafer processes for III-V materials (InP, GaAs, InGaAs, GaSb), including photolithography, wet/dry etch, metal and dielectric deposition, and surface preparation/passivation
  • Develop and sustain FPA-level processes, including indium bump deposition, underfill, and substrate thinning/removal
  • Develop back-end processes including wafer dicing, die-level cleaning, and FPA inspection and screening
  • Perform failure analysis and root-cause investigations on wafer- and FPA-level yield issues and implement corrective actions
  • Create process Travelers and Work Instructions with clear instructions
  • Track processes and make notes via process travelers
  • Run designed experiments to improve process reproducibility and increase yield
  • Participate in device test data reviews and suggest process improvements to improve device performance
  • Provide engineering and operator oversight
  • Mentor and train operators, technicians, and junior engineers in process execution and cleanroom best practices
  • Ensure safe handling of process chemicals and compliance with cleanroom protocols and EHS requirements
  • Perform other duties as assigned

WHAT YOU'LL NEED TO BE SUCCESSFUL:

  • B.S. in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related field; M.S. or Ph.D. preferred
  • Experience with the operation of nanofabrication equipment including Photolithographic stepper, metal deposition, wet/dry etching, SEM, and plasma deposition machines
  • 7-10+ years of experience in microelectronic semiconductor fabrication and wafer handling techniques
  • Candidate should possess a proven track record of developing solutions to process development problems
  • Experience with Design of Experiments and Statistical Process Control
  • Ability to understand and analyze data related to semiconductor device performance
  • Ability to convey data analysis in an accurate and concise format and developing and delivering presentations
  • Experience with creating reports, documenting tests, and creating and reviewing process work instructions
  • Requires U.S. Citizenship or Permanent Resident Status required.

IDEALLY, YOU'LL ALSO HAVE:

  • Familiarity with infrared detector technologies (e.g., InGaAs SWIR, MWIR, LWIR) and FPA/ROIC architectures
  • Experience in mask design and with mask design software
  • Program or project management experience
  • Ability to mentor team members
  • Works well in a fast-paced team environment
  • Strong organizational and communication skills
  • Excellent writing skills and computer capabilities (MS Office, MatLab, Python)
  • Experience in MES, computer programming and software development
  • Ability to complete tasks with minimal supervision
  • Experience working in an ITAR environment

TRAVEL: Little travel is expected for this position, although some out-of-area and overnight travel may be required

ย 

SALARY RANGE: $135,000-$185,000 annual salary, plus participation in individual performance bonus plan.

ย 

Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions of the role.

EOE/AA/M/F/Vets - US Protected Individual status required (US citizen, lawful permanent resident, asylee, refugee or temporary resident (as defined at 8 USC 1160(a).