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If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution.Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Job Description:

DescriptionJoin Skyworks' Advanced IC Packaging team and play a key role in developing advanced semiconductor packaging technologies for wireless products. You will lead thermal and mechanical simulation efforts, influence package design decisions, and work with cross-functional teams to deliver reliable, high-performance packaging solutions from concept through production. Located in the heart of Southern California, our Irvine site offers the opportunity to work on cutting-edge semiconductor technologies while enjoying the exceptional quality of life, vibrant community, and outdoor lifestyle the area is known for.Responsibilities

• Develop detailed thermo-mechanical finite element models (FEM) of IC packages to evaluate stress, strain, and deformation induced by package assembly processes, ensuring robust designs and high manufacturing yield.
• Perform mechanical reliability simulations to characterize package behavior under accelerated reliability test conditions, including thermal cycling, temperature-humidity-bias, power cycling, and mechanical loading, and predict package lifetime and failure mechanisms.
• Setup moldflow simulation models to predict molding process risks including mold fillability, mold pressure distribution, warpage etc.
• Perform second level relaibility simulations to predict solder joint lifetimes under thermal cycling, drop/shock and cyclic bending load conditions.
• Create, maintain, and document simulation methodologies, modeling procedures, automation scripts, and analysis workflows. Communicate results and recommendations effectively to cross-functional engineering teams through technical reports and presentations.
• Collaborate with material suppliers, test laboratories, and internal characterization teams to obtain and validate material properties required for accurate thermal and mechanical modeling.
• Support Package & PCB design, Component Integration and New Technology Introduction (NTI) activities by providing simulation-driven insights and recommendations to improve package performance, reliability, manufacturability, and cost.
• Develop automated simulation workflows and scripting solutions to improve modeling efficiency, reduce turnaround time, and enable scalable analysis across multiple product platforms.
• Work closely with package development, product engineering, reliability, manufacturing, and process teams to identify and resolve design and reliability challenges throughout the product development cycle.
• Correlate simulation predictions with experimental measurements and failure analysis results to continuously improve model accuracy and predictive capability.
• Stay current with advancements in IC packaging technologies, simulation methodologies, material characterization techniques, and industry standards, and drive the adoption of best practices across the organization.

Required Experience and Skills

• BS with 8+ years, MS with 6+ years, or a PhD with 3+ years of experience in Mechanical Engineering or a related field, with a strong background in the thermal and mechanical simulation of electronic packages.
• Strong fundamentals in solid mechanics, heat transfer, materials science, and reliability engineering.
• Hands-on experience with finite element analysis (FEA) tools such as ANSYS (APDL and Workbench), Icepak, ABAQUS, FloTHERM, COMSOL, or equivalent simulation platforms.
• Proven experience in IC package modeling and simulation, including stress, strain, warpage, thermal performance, and reliability assessments.
• Experience modeling package assembly processes such as die attach, wire bonding, molding, curing, and board-level assembly, as well as reliability test conditions including thermal cycling, drop/shock, and mechanical bending.
• Familiarity with advanced packaging technologies and manufacturing processes, including SiP, MCM, WLCSP, flip-chip, and dual-sided package architectures.
• Experience correlating simulation results with experimental data, failure analysis, and reliability testing is highly desirable.
• Knowledge of material characterization techniques and thermal testing methods is a plus.
• Strong communication and presentation skills, with the ability to clearly convey technical findings to cross-functional teams.
• Proficient with common engineering productivity tools, including Microsoft Office applications.

Desired Experience and Skills

• Experience with advanced semiconductor packaging technologies such as flip-chip, fan-out, 2.5D/3D packaging, heterogeneous integration, chiplets, and wafer-level packaging.
• Experience modeling package-to-board interactions, PCB warpage, solder joint reliability, and board-level reliability.
• Knowledge of packaging materials, material characterization techniques, and constitutive material modeling, including viscoelastic and temperature-dependent material behavior.
• Experience developing automated simulation workflows using scripting languages such as Python, APDL, MATLAB, or similar tools.
• Familiarity with Design of Experiments (DOE), statistical analysis, and model calibration techniques.
• Experience supporting high-volume manufacturing and driving yield, reliability, or cost improvements through simulation.
• Experience in RF, BAW/SAW, power management, or other mobile semiconductor packaging technologies.
• Ability to develop new modeling methodologies and build simulation capabilities for emerging package technologies.

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