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Cvd Engineer Jobs in New York (NOW HIRING)

GlobalFoundries

Quantum TSV Integration Engineer

New York, NY · On-site

$113K - $153K/yr

Conformal deposition (PVD/CVD/ALD) * Wafer thinning and reveal * Collaborate with equipment vendors and suppliers to develop new capabilities. * Support qualification of new tooling and materials.

Micron

Films Process Development Engineer

New York, NY · On-site +1

$107K - $182K/yr

As a Thin Films Engineer, you will develop and integrate deposition processes that directly enable ... Experience with ALD, CVD, PECVD, PEALD, and/or LPCVD processes * Knowledge of SPC and process ...

Micron

Films Process Development Engineer

New York, NY · On-site +1

$107K - $182K/yr

Experience with ALD, CVD, PECVD, or related deposition processes * Knowledge of SPC and process maturity for manufacturing * Experience Bringing to bear Artificial Intelligence for data analysis or ...

Equinox

Personal Trainer Internship, NYC

New York, NY · On-site

... programming to maximize each member's health, fitness, and wellness goals while providing the ... Hypertension, Diabetes, Pregnancy, CVD with points on cause, physiological implications, benefits ...

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Cvd Engineer information

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$14

$61

$88

How much do cvd engineer jobs pay per hour?

As of Aug 29, 2026, the average hourly pay for cvd engineer in New York is $61.26, according to ZipRecruiter salary data. Most workers in this role earn between $43.94 and $81.54 per hour, depending on experience, location, and employer.

What does a CVD engineer do?

A CVD Engineer specializes in Chemical Vapor Deposition (CVD), a process used to create thin films and coatings on materials, often for semiconductor or advanced material applications. Their responsibilities typically include designing, operating, and optimizing CVD equipment and processes, troubleshooting issues, and ensuring quality control of the deposited films. CVD Engineers often collaborate with research and development teams to develop new materials and improve manufacturing efficiency. They work in industries such as electronics, solar energy, and materials science.

What are the key skills and qualifications needed to thrive as a CVD engineer?

To thrive as a CVD Engineer, you need a strong background in materials science, chemical engineering, or physics, often supported by a relevant degree and experience in semiconductor manufacturing. Familiarity with chemical vapor deposition (CVD) equipment, process control systems, and cleanroom protocols is typically required. Strong problem-solving abilities, attention to detail, and effective communication are essential soft skills for optimizing processes and collaborating with cross-functional teams. These competencies are crucial for ensuring high-quality thin film production, maintaining equipment reliability, and driving innovation in advanced manufacturing environments.

What are some typical challenges CVD engineers face when optimizing deposition processes for new materials?

CVD Engineers often encounter challenges such as achieving uniform film thickness across substrates, preventing contamination, and managing process stability when introducing new materials. Balancing parameters like temperature, gas flow, and pressure is critical, and even minor variations can impact film quality. Collaboration with material scientists, process engineers, and equipment technicians is essential to troubleshoot these issues and ensure successful scale-up from lab to production environments.

What is a CVD process engineer?

A CVD (Chemical Vapor Deposition) process engineer specializes in developing and optimizing thin film deposition processes using chemical reactions in vapor form to create coatings on substrates. They work with equipment such as reactors and vacuum systems, often requiring knowledge of materials science, process control, and safety protocols to ensure high-quality film production in semiconductor or advanced material manufacturing. This role typically involves process troubleshooting, data analysis, and collaboration with R&D teams.

What are the most commonly searched types of Cvd Engineer jobs in New York?

The most popular types of Cvd Engineer jobs in New York are:

Cvd Engineer jobs near you
Infographic showing various Cvd Engineer job openings in New York as of August 2026, with employment types broken down into 67% Full Time, and 33% Part Time. Highlights an 67% In-person, and 33% Remote job distribution, with an average salary of $127,415 per year, or $61.3 per hour.

Quantum TSV Integration Engineer

GlobalFoundries

New York, NY • On-site

$113K - $153K/yr

Full-time

Re-posted 12 days ago

GlobalFoundries rating

8.3

Company rating: 8.3 out of 10

Based on 35 frontline employees who took The Breakroom Quiz

65th of 545 rated manufacturers

Job description

GlobalFoundries Fab8 is seeking a highly skilled and motivated R&D TSV engineer to become part of our Quantum Advanced Packaging team. The primary responsibility of this position is to own development and integration of cryogenic, superconducting TSV technologies enabling high-density vertical interconnects for scalable quantum packaging from concept through manufacturing.
About GlobalFoundries
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.
Job Summary
GlobalFoundries Fab8 is seeking a highly skilled and motivated R&D TSV engineer to become part of our Quantum Advanced Packaging team. The primary responsibility of this position is to own development and integration of cryogenic, superconducting TSV technologies enabling high-density vertical interconnects for scalable quantum packaging from concept through manufacturing.
Essential Responsibilities
  • Lead development of through-silicon via (TSV) processes for cryogenic and superconducting applications.
  • Define TSV architectures including:
    • Superconducting liners (e.g., Nb, Al-based)
    • Dielectric isolation schemes
    • Via geometries (diameter, depth, pitch)
  • Ensure TSV designs are optimized for:
    • Low-loss electrical/RF signal transport
    • Cryogenic thermal and mechanical stability
  • Own end-to-end TSV integration flows across:
    • Via etch, liner deposition, dielectric, and metallization
    • Wafer thinning, reveal, and backside processing
    • Integration into 2.5D/3D packaging stacks
  • Drive process integration planning to enable prototyping and qualification across programs.
  • Develop TSV solutions for superconducting interposers and 3D integration platforms
  • Support integration with:
    • Bump/interconnect layers
    • Redistribution routing layers (RDL)
    • Assembly and bonding flows
  • Ensure TSVs enable high-density vertical interconnects for quantum system scaling.
  • Enable prototype builds and development lots, ensuring smooth execution through fab and assembly flows.
  • Support transition from R&D to pilot to manufacturable flows.
  • Collaborate with device/test teams to ensure TSVs meet:
    • Cryogenic electrical performance requirements (DC + RF/microwave)
    • Low resistance and minimal loss for superconducting operation
  • Support characterization of:
    • Signal integrity (noise, crosstalk)
    • Thermal leakage across vias
  • Develop strategies to improve:
    • TSV yield and process robustness
    • Integration reliability under cryogenic conditions
  • Identify and analyze failure modes such as:
    • Liner defects / discontinuities
    • Delamination or cracking during thermal cycling
    • Void formation or via integrity issues
  • Lead root-cause analysis and corrective actions.
  • Work closely with materials teams to:
    • Select TSV liner and dielectric materials compatible with superconducting operation
    • Understand cryogenic behavior (CTE mismatch, stress, superconductivity limits)
  • Optimize interface integrity between via liner, dielectric, and substrate.
  • Define requirements for TSV-specific process tools:
    • Deep silicon etch (DRIE)
    • Conformal deposition (PVD/CVD/ALD)
    • Wafer thinning and reveal
  • Collaborate with equipment vendors and suppliers to develop new capabilities.
  • Support qualification of new tooling and materials.
  • Interface across:
    • Interconnect (bump / RDL) teams
    • Assembly and integration engineers
    • Device / qubit / system engineers
  • Ensure co-optimization of TSVs with full packaging stack.
  • Drive development of next-generation TSV scaling, including:
    • Smaller diameters and higher aspect ratios
    • Alignment with micro-bump pitch scaling
  • Contribute to cryogenic 3DHI roadmap and APPC capability build-out.
  • Evaluate novel via concepts (e.g., superconducting-lined, partially filled, or air-gap vias).
  • Generate:
    • TSV integration flows and specifications
    • Design rules and process documentation
  • Provide technical updates, reports, and data-driven insights.
  • Contribute to IP, publications, and conference outputs.

Other Responsibilities
  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
  • Take part in hiring of other Advanced Packaging team members in Singapore.
  • Mentor and guide new hires to assume their roles and responsibilities.
  • Other duties as assigned by manager.

Required Qualifications
  • Education - Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
  • MS degree with at least 8 years of prior related work experience.
  • Must have at least an overall 3.0 GPA and proven good academic standing.
  • Language Fluency - English (Written & Verbal).
  • Travel - Up to 20%.

Preferred Qualifications
  • Education - PhD education level preferred with at least 5 years of prior related work experience.
  • Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
  • Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
  • Strong written and verbal communication skills.
  • Strong planning & organizational skills.

Additional Information
GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard. As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities. All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.
Expected Salary Range
$98,000.00 - $176,000.00
The exact Salary will be determined based on qualifications, experience and location.
If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.
An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.
GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.
All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law

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