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Contract Rfic Design Engineer Jobs in Phoenix, AZ

Industrial Design

Design & Engineering Scheduler

Chandler, AZ · On-site

$18.25 - $23.50/hr

Develop and maintain detailed design and engineering schedules. Sequence project tasks, milestones ... Submissions then will only be permitted in conjunction with a fully executed service contract in ...

Medium

Lead Electrical & RF Engineer

Phoenix, AZ · On-site

$140 - $190/hr

... contract design organizations. The successful candidate will drive innovation in Size, Weight ... Lead electrical engineering activities for the development of RF airborne avionics products from ...

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Contract Rfic Design Engineer information

What are the key skills and qualifications needed to thrive as a contract RFIC design engineer, and why are they important?

To thrive as a Contract RFIC Design Engineer, you need expertise in RF/microwave circuit design, semiconductor physics, and familiarity with industry standards, typically supported by a degree in electrical engineering or a related field. Mastery of EDA tools like Cadence, ADS, and experience with simulation and layout software are critical, along with knowledge of relevant test equipment. Strong problem-solving abilities, attention to detail, and effective communication set top engineers apart in collaborative and deadline-driven environments. These skills ensure the delivery of high-performance, reliable RFIC solutions that meet project specifications and industry demands.

What is a contract RFIC design engineer?

Contract RFIC (Radio Frequency Integrated Circuit) Design Engineers are specialists who design and develop integrated circuits that operate at radio frequencies, typically for wireless communication devices. Working on a contract basis, they may be hired by companies to complete specific projects or to provide expertise on a temporary basis. Their responsibilities include circuit design, simulation, layout, testing, and optimization of RFICs to meet performance, cost, and timeline requirements. Contract RFIC Design Engineers often collaborate with teams of hardware and software engineers to ensure seamless integration of RFICs within larger systems. They are also expected to stay updated on the latest technologies and design tools in the RF and semiconductor industries.

What are some common challenges faced by contract RFIC design engineers when working with multiple clients or projects simultaneously?

Contract RFIC Design Engineers often juggle multiple projects and clients, which can lead to challenges in balancing differing technical requirements, project timelines, and communication styles. Coordinating with various teams, adapting to distinct design flows, and managing version control across projects demand strong organizational and interpersonal skills. Successfully navigating these challenges helps ensure timely delivery of high-quality RFIC designs, while also building a reputation for reliability and adaptability in the industry.

What is the difference between Contract Rfic Design Engineer vs RFIC Design Engineer?

AspectContract RFIC Design EngineerRFIC Design Engineer
CredentialsBachelor's or Master's in Electrical Engineering, specialized in RFIC designSame as Contract RFIC Design Engineer
Work EnvironmentProject-based, often freelance or temporary roles in various companiesFull-time employment within a company or research lab
Industry UsageCommon in consulting, contract work, or short-term projectsStandard role in semiconductor and telecommunications industries

Both roles require similar technical skills and educational background, but Contract RFIC Design Engineers typically work on short-term projects and are hired on a contractual basis, whereas RFIC Design Engineers are usually full-time employees with ongoing responsibilities.

What are the most commonly searched types of Rfic Design Engineer jobs in Phoenix, AZ? The most popular types of Rfic Design Engineer jobs in Phoenix, AZ are:
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What job categories do people searching Contract Rfic Design Engineer jobs in Phoenix, AZ look for? The top searched job categories for Contract Rfic Design Engineer jobs in Phoenix, AZ are:
Contract Rfic Design Engineer jobs near you
Infographic showing various Contract Rfic Design Engineer job openings in Phoenix, AZ as of August 2026, with employment types broken down into 87% Full Time, 8% Part Time, and 5% Contract. Highlights an 85% Physical, 4% Hybrid, and 11% Remote job distribution.

Sr Staff Package Design Engineer

Renesas Electronics

Tempe, AZ • On-site

Full-time

Re-posted yesterday

Job description

Company Description
Job Description
  • Design and develop package and interconnect methods for Renesas's packaging needs in the areas of Power SiP/modules, WLCSP, multi-chip module with substrate or embedded die/capacitor and power device packaging.
  • Develop Cu RDL with seed layer on IC wafer and FET and Backside metal deposit after grinding
  • Wafer thinning development through Taiko BG and Glass carrier bond
  • Define substrate, die interconnection through via, materials and PCB interface requirements
  • Package technologies qualification for consumer & industrial power as well as automotive power applications.
  • Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
  • Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
  • Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
  • Resolve all process integration issues by ensuring all window checks are done on critical process steps.
  • Establish production controls and monitor to ensure there is no room for quality incidents.
  • Ensure smooth transition into production & implement ramp up monitor.
  • Work with OSAT/CM to monitor and resolve process issues early in the production stage to ensure only parts with superior quality shipped to customer.
  • Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects in LGA.
  • Participate in packaging roadmap development & focus on execution.
  • Address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.
  • Establish & maintain package design rules

Qualifications
  • Doctorate/Masters / Bachelor's Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
  • 10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip LGA packaging.
  • Strong understanding of power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of Cu FSM/BGBM technologies a plus.
  • Strong interpersonal and communication skills.
  • Strong analytical and presentation skills.

Additional Information
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
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