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Contract Rf Ic Design Engineer Jobs in Texas (NOW HIRING)

IC Enable

IC Layout Design Engineer

Richardson, TX · Hybrid

The team has an exciting opportunity for a IC Layout Design Engineer V to join our diverse team ... Efficiently laying out sensitive RF, Analog and Mixed Signal circuits conforming to all physical ...

Neuralink

Digital IC Design Engineer

Austin, TX · On-site

$134K/yr

Our Digital IC Design Engineer will be responsible for delivering micro-architecture and register-transfer level (RTL) implementation of digital IPs and systems with a focus in high-throughput low ...

Neuralink

Digital IC Design Engineer

Austin, TX · On-site

$116K - $233K/yr

Our Digital IC Design Engineer will be responsible for delivering micro-architecture and register-transfer level (RTL) implementation of digital IPs and systems with a focus in high-throughput low ...

Apple

IC Package Design Engineer

Austin, TX · On-site

$134K/yr

... memory, RF, and cellular technologies. You will play a key role in shaping the architecture ... As a Package design engineer, you will lead advanced package architecture, drive next-generation ...

Apple

SIPI - RF Integrity Engineer

Austin, TX · On-site

As an RF Integrity Engineer, you will dive deep into package design, SI/PI, and RF technology to ... Experience with the IC design and simulation flow.Hands-on experience in RF module/board ...

Marvell

Principal Digital IC Design Engineer

Austin, TX

$134K/yr

Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field with 10+ years of professional experience in digital IC design, OR Master's degree with 5+ years ...

Apple

IC Package Design Engineer

Austin, TX

$171K - $302K/yr

... for a Package Design Engineer to drive the physical design and integration of advanced ... memory, RF, and cellular technologies. You will play a key role in shaping the architecture ...

Apple

IC Package Design Engineer

Austin, TX

$171K - $302K/yr

... for a Package Design Engineer to drive the physical design and integration of advanced ... memory, RF, and cellular technologies. You will play a key role in shaping the architecture ...

Apple

IC Package Design Engineer

Austin, TX

$171K - $302K/yr

... for a Package Design Engineer to drive the physical design and integration of advanced ... memory, RF, and cellular technologies. You will play a key role in shaping the architecture ...

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All JobsContract Rf Ic Design Engineer JobsContract Rf Ic Design Engineer Jobs in Texas

Contract Rf Ic Design Engineer information

What are the key skills and qualifications needed to thrive as a Contract RF IC Design Engineer, and why are they important?

To thrive as a Contract RF IC Design Engineer, you need a strong background in analog and RF circuit design, semiconductor physics, and relevant engineering degrees, typically in electrical or electronics engineering. Experience with EDA tools like Cadence Virtuoso, ADS, or Mentor Graphics, and knowledge of industry standards for IC layout and verification are essential. Strong problem-solving abilities, attention to detail, and effective teamwork and communication skills set top candidates apart. These competencies ensure the development of high-performance, reliable ICs that meet demanding technical specifications and project deadlines.

What is the difference between Contract Rf Ic Design Engineer vs Contract Digital IC Design Engineer?

AspectContract Rf Ic Design EngineerContract Digital IC Design Engineer
Required SkillsRF circuit design, analog and mixed-signal design, simulation toolsDigital logic design, HDL (VHDL/Verilog), FPGA/ASIC design
Work EnvironmentSemiconductor companies, telecommunications, aerospaceConsumer electronics, computing, data centers
CertificationsRelevant EE degrees, RF design certificationsEE degrees, digital design certifications

The main difference between a Contract Rf Ic Design Engineer and a Contract Digital IC Design Engineer lies in their focus areas. RF IC engineers specialize in high-frequency analog and RF circuit design, while digital IC engineers focus on digital logic and FPGA/ASIC development. Both roles require strong EE backgrounds but differ in their technical skills and industry applications.

What is a Contract RF IC Design Engineer?

A Contract RF IC (Radio Frequency Integrated Circuit) Design Engineer is a specialist who designs, develops, and tests integrated circuits that operate at radio frequencies, typically for wireless communication products. Working on a contract basis, these engineers are hired for specific projects and may work for different companies as needed. Their responsibilities include circuit design, simulation, layout, and verification of RF components such as amplifiers, mixers, and oscillators. They often collaborate with other engineers to ensure the circuits meet performance specifications and industry standards. Contract RF IC Design Engineers are essential in industries like telecommunications, consumer electronics, and aerospace.

What are some common challenges faced by Contract RF IC Design Engineers, and how can they be addressed?

Contract RF IC Design Engineers often face challenges such as quickly adapting to new project requirements, integrating with existing design teams, and managing tight deadlines. Since each client or project may use different design tools or methodologies, flexibility and strong communication skills are essential. Building a solid understanding of the project's specifications early on and maintaining open communication with both in-house engineers and project managers can help ensure smooth collaboration and timely delivery. Proactively seeking feedback and clarifying expectations also aids in overcoming these challenges.
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Contract Rf Ic Design Engineer jobs near you
Sr. IC Package Design Engineer (Silicon Engineering)

Sr. IC Package Design Engineer (Silicon Engineering)

SpaceX

Austin, TX

Other

Posted 18 days ago

SpaceX rating

8.7

Company rating: 8.7 out of 10

Based on 143 frontline employees who took The Breakroom Quiz

13th of 60 rated aerospace companies

Job description

SR. IC PACKAGE DESIGN ENGINEER (SILICON ENGINEERING) 

At SpaceX we're leveraging our experience in building rockets and spacecraft to deploy Starlink, the world's most advanced broadband internet system. Starlink is the world's largest satellite constellation and is providing fast, reliable internet to millions of users worldwide. We design, build, test, and operate all parts of the system - thousands of satellites, consumer receivers that allow users to connect within minutes of unboxing, and the software that brings it all together. We've only begun to scratch the surface of Starlink's potential global impact and are looking for best-in-class engineers to help maximize Starlink's utility for communities and businesses around the globe. 

We are seeking a motivated, proactive, and intellectually curious engineer who will work alongside world-class cross-disciplinary teams (systems, firmware, architecture, design, validation, product engineering, ASIC implementation). In this role, you will be developing cutting-edge next-generation ASICs for deployment in space and ground infrastructures around the globe. These chips are enabling connectivity in places it has previously not been available, affordable or reliable. As an IC Package Design Engineer, you will be an integral part of the IC design team and lead packaging for custom in-house ASICs and RFICs for digital beam formers and modems. 

RESPONSIBILITIES:

  • Own and drive advanced package selection, new product BGA configuration and package structure
  • Responsible for package/SIP layout, optimization, design verification and tapeout
  • Interface and coordinate with cross-functional groups throughout SpaceX on new product package selection, feasibility analysis and design
  • Work cross-functionally, understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out
  • Simulate and optimize signal/power integrity and RF performance of the package design
  • Drive methodology, innovations, and productivity improvements in package design

BASIC QUALIFICATIONS:

  • Bachelor's degree in electrical engineering, computer engineering, or physics
  • 5+ years of experience with IC package design

PREFERRED SKILLS AND EXPERIENCE:

  • Experience with Co-packaged Optics (CPO)
  • Thorough understanding of signal and power integrity fundamentals
  • Substrate design experience for RF, digital, high-speed and mixed signal die
  • Experience with Cadence APD+/SIP or similar design tools
  • Experience in package design electrical review, SI/PI analysis
  • Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, ADS
  • Experience in package design for manufacturing reviews
  • Familiar with BGA package substrate technologies
  • Strong problem solving skills with strong engineering fundamentals

ADDITIONAL REQUIREMENTS:

  • Ability to work extended hours or weekends as needed to meet mission critical deadlines

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