1

Contract Rf Ic Design Engineer Jobs in Oregon (NOW HIRING)

Memory bit-cell and complex periphery IC layout and automation. * Memory array/IP design, memory ... Master degree in Electrical Engineering, Computer Engineering, Electrical and Computer Engineering ...

Summary The Bridge Design Engineer is responsible for independently performing engineering tasks ... Writes technical specifications and develops contract plans independently * Assembles structural ...

Summary The Bridge Design Engineer is responsible for independently performing engineering tasks ... Writes technical specifications and develops contract plans independently * Assembles structural ...

Summary The Bridge Design Engineer is responsible for independently performing engineering tasks ... Writes technical specifications and develops contract plans independently * Assembles structural ...

Summary The Bridge Design Engineer is responsible for independently performing engineering tasks ... Writes technical specifications and develops contract plans independently * Assembles structural ...

Summary The Bridge Design Engineer is responsible for independently performing engineering tasks ... Writes technical specifications and develops contract plans independently * Assembles structural ...

Summary The Bridge Design Engineer is responsible for independently performing engineering tasks ... Writes technical specifications and develops contract plans independently * Assembles structural ...

Mechanical Design Engineer This role involves working closely with both the Research and ... Contract to Hire position based out of Hillsboro, OR. Pay and Benefits The pay range for this ...

In this role, you will actively work with cross-functional Analog Mixed-Signal design teams to ... IC development from definition to high-volume production including layout supervision, bench ...

Showing results 21-40

Contract Rf Ic Design Engineer information

What is a contract RF IC design engineer?

A Contract RF IC (Radio Frequency Integrated Circuit) Design Engineer is a specialist who designs, develops, and tests integrated circuits that operate at radio frequencies, typically for wireless communication products. Working on a contract basis, these engineers are hired for specific projects and may work for different companies as needed. Their responsibilities include circuit design, simulation, layout, and verification of RF components such as amplifiers, mixers, and oscillators. They often collaborate with other engineers to ensure the circuits meet performance specifications and industry standards. Contract RF IC Design Engineers are essential in industries like telecommunications, consumer electronics, and aerospace.

What are the key skills and qualifications needed to thrive as a contract RF IC design engineer?

To thrive as a Contract RF IC Design Engineer, you need a strong background in analog and RF circuit design, semiconductor physics, and relevant engineering degrees, typically in electrical or electronics engineering. Experience with EDA tools like Cadence Virtuoso, ADS, or Mentor Graphics, and knowledge of industry standards for IC layout and verification are essential. Strong problem-solving abilities, attention to detail, and effective teamwork and communication skills set top candidates apart. These competencies ensure the development of high-performance, reliable ICs that meet demanding technical specifications and project deadlines.

What are some common challenges faced by contract RF IC design engineers, and how can they be addressed?

Contract RF IC Design Engineers often face challenges such as quickly adapting to new project requirements, integrating with existing design teams, and managing tight deadlines. Since each client or project may use different design tools or methodologies, flexibility and strong communication skills are essential. Building a solid understanding of the project's specifications early on and maintaining open communication with both in-house engineers and project managers can help ensure smooth collaboration and timely delivery. Proactively seeking feedback and clarifying expectations also aids in overcoming these challenges.

What is the difference between Contract Rf Ic Design Engineer vs Contract Digital IC Design Engineer?

AspectContract Rf Ic Design EngineerContract Digital IC Design Engineer
Required SkillsRF circuit design, analog and mixed-signal design, simulation toolsDigital logic design, HDL (VHDL/Verilog), FPGA/ASIC design
Work EnvironmentSemiconductor companies, telecommunications, aerospaceConsumer electronics, computing, data centers
CertificationsRelevant EE degrees, RF design certificationsEE degrees, digital design certifications

The main difference between a Contract Rf Ic Design Engineer and a Contract Digital IC Design Engineer lies in their focus areas. RF IC engineers specialize in high-frequency analog and RF circuit design, while digital IC engineers focus on digital logic and FPGA/ASIC development. Both roles require strong EE backgrounds but differ in their technical skills and industry applications.

Infographic showing various Contract Rf Ic Design Engineer job openings in Oregon as of August 2026, with employment types broken down into 84% Full Time, 4% Part Time, and 12% Contract. Highlights an 96% In-person, and 4% Remote job distribution.

Analog and Mixed Signal Design Engineer

Intel

Hillsboro, OR • On-site

$164K - $269K/yr

Full-time

Medical, Retirement, PTO

Re-posted 22 days ago


Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

18th of 159 rated electronics manufacturers


Job description

Job Details:Job Description: 

The Group: Intel's Advanced Design Foundational IP Organization (AD-FIP) within Design Technology Platform (DTP) focuses on pathfinding and development of advanced logic, memory, and analog/mixed-signal circuits to enable best-in-class Foundational IP collateral and product design across all generations of Intel process technology. Critical technologies AD-FIP delivers to Intel are Digital and Analog Standard Cell Libraries, Embedded Memory (SRAM, RF, ROM, eDRAM, Fuse, etc.), Analog Circuit Reference Designs (PLL, BGR, ADC, etc.), High-speed I/O Reference Designs (DDR, UCIe, PCIe, SerDes, GPIO), RF and Wireless Circuits (Wave Guide TX, Power Amplifier).

As an analog and mixed-signal IC designer your day-to-day responsibilities will include, but not always be limited to:

  • Developing, designing and testing circuit blocks including wireline IO AFEs, clocking circuits, and voltage regulator circuits as well as integrating them into Intel's leading technology test chips.
  • Capture of design and measurement results to guide the next generation of process technology and circuit specifications based on requirements for SoC building blocks and critical wireline interfaces.
  • Work closely with process and IP engineers to anticipate AMS IP requirements and use design and test results to inform and accelerate process technology and product development.
Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • Bachelor's degree in Electrical, Computer or Electrical and Computer Engineering, or related STEM field with 10+ years of experience, OR
  • Master's degree in Electrical, Computer or Electrical and Computer Engineering, or related STEM field with 8+ years of experience, OR
  • Ph.D. in Electrical, Computer or Electrical and Computer Engineering, or related STEM field with 3+ years of experience.

The qualifications listed below must meet the required years of experience associated with the candidate's degree level:

  • Experience with design of custom analog or mixed-signal circuits.
  • Analog or mixed signal design skills including specification, design or verification.

Preferred Qualifications:

Experience in one or more of the following areas is preferred:

  • GPIOs, high speed parallel or serial IO links and their subcomponents (data path, TX, RX, etc.), clock distribution, clock conditioning, clock recovery circuits, voltage regulators, voltage reference circuits, ADCs/DACs, inductors, transmission lines, RF and millimeter-wave circuits, test of custom analog and mixed-signal circuits.
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:US, California, Santa ClaraBusiness group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $164,470.00-269,100.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

What Intel employees say

Pay

Benefits

Hours and flexibility

Workplace

Get the full story on Breakroom


Intel logo

About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968