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Contract Dry Etch Engineer Jobs in Rio Rancho, NM

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Contract Dry Etch Engineer information

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$28

$46

$93

How much do contract dry etch engineer jobs pay per hour?

As of May 30, 2026, the average hourly pay for contract dry etch engineer in Rio Rancho, NM is $46.03, according to ZipRecruiter salary data. Most workers in this role earn between $38.65 and $47.69 per hour, depending on experience, location, and employer.

What is the difference between Contract Dry Etch Engineer vs Process Engineer?

AspectContract Dry Etch EngineerProcess Engineer
CredentialsBachelor's or Master's in Electrical, Chemical, or Materials EngineeringBachelor's or Master's in similar engineering fields, often with additional certifications
Work EnvironmentCleanroom semiconductor fabrication facilities, focusing on etching processesVarious manufacturing settings, overseeing overall process optimization
Industry UsagePrimarily in semiconductor manufacturing companies and foundriesBroader manufacturing industries, including electronics and microfabrication

The Contract Dry Etch Engineer specializes in specific etching processes within semiconductor fabrication, focusing on dry etching techniques. In contrast, Process Engineers oversee broader manufacturing processes, including process development and optimization. While both roles require similar technical credentials and work in cleanroom environments, their scope and responsibilities differ significantly.

What are popular job titles related to Contract Dry Etch Engineer jobs in Rio Rancho, NM? For Contract Dry Etch Engineer jobs in Rio Rancho, NM, the most frequently searched job titles are:
What job categories do people searching Contract Dry Etch Engineer jobs in Rio Rancho, NM look for? The top searched job categories for Contract Dry Etch Engineer jobs in Rio Rancho, NM are:
Contract Dry Etch Engineer jobs near you
Infographic showing various Contract Dry Etch Engineer job openings in Rio Rancho, NM as of May 2026, with employment types broken down into 92% Full Time, 3% Part Time, 1% Temporary, and 4% Contract. Highlights an 100% Physical job distribution, with an average salary of $95,736 per year, or $46 per hour.
Dry Etch Process Development Engineer

Dry Etch Process Development Engineer

Skorpios Technologies Inc

Albuquerque, NM • On-site

Full-time

This job post has expired 1 day ago. Applications are no longer accepted.

Job description

Description:

Job Purpose

The Dry Etch Process Development Engineer is responsible to help support the development of

manufacturable, repeatable, and high yielding processes for state-of-the-art highly specialized devices in the

fields of Aerospace, Defense, Bioelectronics, and High-Speed Communications.


Essential Responsibilities


• Partner with Integration Engineers, Customers, and Other Development Engineers to execute

experiments and adjust or optimize processes for Fab Operation.

• Partner with Product Engineering and Integration to help ensure effective new products and

process introductions as well as consistent device performance and quality.

• Guide and assist Process Technicians through challenging process steps.

• Analyze metrology results and disposition lots based on data and pass/fail criteria.

• Report and summarize results from the metrology analysis and provide guidance to Integration

Engineering Team and Process Development Engineering Team.

• Provide effective pass-downs to support uninterrupted operation for Dry Etch activities.

• Sustain and improve processes for wafer fabrication.

• Partner with equipment engineering, operation, and management to improve cycle time, tool

availability, quality, and product yields.

• Using Document Control, Process Work Instructions, and Manufacturing Execution Systems,

preserve working knowledge of all codes and standards applicable to assigned production

equipment.

• Assure that the manufactured products conform to specifications and application requirements.

• Partner with Senior Development Engineering team and Integration teams to resolve deviations or

technical issues by establishing a list of hypotheses, defining the experiment to validate or

invalidate hypothesis, identify root-causes, implement corrective actions, document improved

process, and train operations

• Sustain existing processes in the areas of, Reactive Ion Etching (RIE), Deep RIE (DRIE), Magnetron

RIE (MRIE), Inductively Coupled Plasma etching (ICP), Microwave Ashing, Transformer Coupled

Plasma etching (TCP), Dipole Ring Magnetron etching (DRM) and Barrel etching, etch process

recipe creations, inspections, defects control, and standard Dry Etch related metrology such as

ellipsometry or profilometry.

• Create and maintain operating specifications for production processes and equipment.

• Monitor process health with Statistical Process Control (SPC) and respond to out-of-control event

following out-of-control action plan

Requirements:

Education


BS in Electrical Engineering, Material Science, Physics, Chemistry, or related + 9 years, MS + 7 years, or

Ph.D. + 4 years.


Must be able to work offset shifts: Front-End Days (starts on Sundays, ends on Thursdays) or Back-End Days (starts on Tuesdays, ends Saturdays).


Experience

Processing experience in a fab in the area of Dry Etch processing using Reactive Ion Etching (RIE), Deep

RIE (DRIE), Magnetron RIE (MRIE), Inductively Coupled Plasma etching (ICP), and Microwave Ashing.


Ability to operate processing tools, write and run Dry Etch recipes, inspect wafers under the

microscope, and perform basic characterization related to Dry Etch processing with particles / defects

metrology, and thickness / uniformity metrology.


Statistical Process Control (SPC)