ZipRecruiter

Log In

1

Chip Jobs in Arizona (NOW HIRING)

ARM

Staff Board - Package co-design Engineer

Chandler, AZ · On-site

$198K - $268K/yr

Focus on driving the PCB development alongside the chip packaging team, including brainstorming breakout and routing strategies, design rules and layer optimization to ensure optimal performance ...

ARM

Staff Board - Package co-design Engineer

Chandler, AZ · Hybrid

$198K - $268K/yr

Focus on driving the PCB development alongside the chip packaging team, including brainstorming breakout and routing strategies, design rules and layer optimization to ensure optimal performance ...

Intel

Principal Collateral Device Engineer

Phoenix, AZ · On-site

Expertise in CMOS semiconductor device physics and test chip design for advanced transistor device architecture. * Experience in scribe line layout design and process monitoring structure development.

previous pagenext page

Showing results 21-40

All JobsChip JobsChip Jobs in Arizona

Chip information

What does a chip engineer do?

Chip engineers, also known as semiconductor or integrated circuit (IC) engineers, design, develop, and test microchips or semiconductor devices used in electronic equipment. They work on the architecture, layout, and manufacturing processes for chips that power everything from smartphones to computers and cars. Their responsibilities include circuit design, simulation, verification, and ensuring chips meet performance and reliability standards. Chip engineers often collaborate with software engineers and hardware teams to integrate chips into larger systems. Their work is crucial to advancing technology in many industries.

What are some of the typical challenges faced by chip design engineers during the development cycle?

Chip design engineers often encounter challenges such as meeting tight performance and power consumption targets, ensuring design verification coverage, and managing complex cross-functional collaboration with software, hardware, and testing teams. Balancing optimal design with manufacturability and cost constraints is also a common concern. Staying updated on rapidly evolving semiconductor technologies and adhering to industry standards requires continual learning and adaptability.

What are the key skills and qualifications needed to thrive as a chip design engineer, and why are they important?

To thrive as a Chip Design Engineer, you need a strong background in electrical engineering, digital logic design, and semiconductor physics, usually supported by a relevant degree. Proficiency with hardware description languages (HDLs) like VHDL or Verilog, and experience using industry-standard EDA tools such as Cadence or Synopsys, are typically required. Analytical thinking, attention to detail, and effective teamwork are vital soft skills for excelling in this field. These skills ensure innovative, efficient, and error-free chip designs that meet rigorous industry standards.

What is the difference between Chip vs PCB Designer?

AspectChipPCB Designer
Required CredentialsElectrical Engineering degree, VLSI/ASIC design certificationsElectrical Engineering or related degree, PCB design certifications (e.g., IPC)
Work EnvironmentSemiconductor fabrication labs, R&D centersElectronics manufacturing, engineering offices
Industry UsageSemiconductor industry, integrated circuit manufacturingConsumer electronics, industrial equipment
Common Search/ComparisonChip design, VLSI, ASICPCB layout, circuit board design

In summary, a Chip focuses on designing integrated circuits at the silicon level, requiring specialized knowledge in VLSI and semiconductor fabrication. A PCB Designer, on the other hand, creates the physical layout of circuit boards used in electronic devices. Both roles are essential in electronics but differ significantly in scope, environment, and technical expertise.

How to become a chip worker?

To become a chip worker, typically one needs a high school diploma or equivalent, along with technical skills related to electronics or manufacturing. Relevant experience or certifications in semiconductor fabrication, cleanroom procedures, or equipment operation can improve job prospects. Entry-level positions often require attention to detail and adherence to safety protocols in a controlled environment.

What are popular job titles related to Chip jobs in Arizona?

For Chip jobs in Arizona, the most frequently searched job titles are:

What job categories do people searching Chip jobs in Arizona look for?

The top searched job categories for Chip jobs in Arizona are:

What cities in Arizona are hiring for Chip jobs?

Cities in Arizona with the most Chip job openings:

Chip jobs near you
Infographic showing various Chip job openings in Arizona as of August 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution.

Director, Package Design Engineering

Phoenix, AZ • On-site

Renesas Electronics
See more jobs at Renesas Electronicsexternal

Full-time

Posted 27 days ago

Job description

Company Description
Company Description
Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portfolio includes world leading MCUs, SoCs, Analog and power products, plus Winning Combination solutions that curate these complementary products. We are a key supplier to the world's leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you.
Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what's next in electronics and the world.
Job Description
Responsibilities:
  • Package Technology Development/NPI, R&D, Global OSAT management for new Package Development/Product qualification, Technology Roadmap definition, R&D budget management & customer adoption programs.
  • Focus on design and development of package and interconnect methods for Renesas's AI/Datacenter Infrastructure Power packaging needs especially Smart Power Stages, Vertical Power Stages, Power Modules & Discrete FET packages. Scope also involves WBG (Ie. SiC & GaN) development along with DBC, AMB substrates and advanced interconnect technologies. Knowledge of wafer level, flip-chip, multi-chip module and power devices will be a plus.
  • Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
  • Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
  • Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
  • Resolve all process integration issues by ensuring all window checks are done on critical process steps.
  • Establish production controls and monitors to ensure there is no room for quality incidents.
  • Ensure smooth transition into production & implement ramp up monitor.
  • Work with OSAT/CM to monitor and resolve process issues early in the production phase to ensure only parts with superior quality shipped to customer.
  • Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects.
  • Participate in packaging roadmap development & focus on execution.
  • Address internal and external customer complaints working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.
  • Establish & maintain package design rules.

Qualifications
Qualifications:
  • Doctorate/Masters / Bachelor's Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
  • 15 to 20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging
  • Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software
  • Knowledge of wire-bonding & multi-chip module technologies a plus.
  • Strong interpersonal and communication skills.
  • Strong analytical and presentation skills.

Additional Information
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
Videos To Watch
https://www.youtube.com/watch?v=k-zs4tB6nNc

Apply