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Advanced Packaging Microelectronics Jobs (NOW HIRING)

$90 - $130/hr

The selected candidate will analyze the microelectronic components, semiconductor technologies, integrated circuits, processors, RF devices, timing devices, and advanced packaging solutions that ...

New

$140 - $190/hr

Business DevelopmentProgram Manager - Microelectronics Project Delivery Company Overview At ... semiconductor, advanced packaging, solar manufacturing, datacenter, and other advanced ...

Program Manager - Microelectronics Project Delivery Company Overview At Aquatech, we tackle the ... semiconductor, advanced packaging, solar manufacturing, datacenter, and other advanced ...

Learn more at www.aquatech.com Aquatech has an immediate need for a full-time Microelectronics Project Engineer to support global semiconductor, advanced packaging, solar manufacturing, and data ...

$86 - $147/hr

Our employees work on the world's most advanced electronics - from saving emissions in the City of ... Our team needs engineers interested in designing and developing the Microelectronics packages ...

Chief Packaging Engineer - 906

Broomfield, CO ยท On-site

$208K - $260K/yr

A successful candidate will have a broad and deep understanding of microelectronic and photonic ... Define, develop, and drive an advanced packaging architecture for our next generation of ion traps ...

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Advanced Packaging Microelectronics information

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How much do advanced packaging microelectronics jobs pay per hour?

As of Sep 6, 2026, the average hourly pay for advanced packaging microelectronics in the United States is $16.95, according to ZipRecruiter salary data. Most workers in this role earn between $14.42 and $17.79 per hour, depending on experience, location, and employer.

What is advanced packaging microelectronics?

Advanced Packaging Microelectronics refers to the use of innovative techniques and materials to package semiconductor devices, such as chips, in a way that improves their performance, reduces size, and enhances energy efficiency. This field involves integrating multiple chips or components into a single package, often using technologies like 2.5D/3D integration, system-in-package (SiP), and wafer-level packaging. These advanced packaging methods enable faster data transfer, better thermal management, and higher functionality in electronic devices, making them crucial for applications in smartphones, data centers, automotive electronics, and more.

What are the key skills and qualifications needed to thrive as an advanced packaging microelectronics engineer?

To thrive as an Advanced Packaging Microelectronics Engineer, you need a solid background in electrical engineering, materials science, and semiconductor fabrication, often supported by a relevant degree. Familiarity with CAD tools, process simulation software, and industry standards like IPC and JEDEC, along with experience in cleanroom environments, is highly valuable. Strong problem-solving abilities, attention to detail, and effective teamwork and communication distinguish top performers in this field. These skills ensure the development of innovative, reliable, and high-performance microelectronic packaging solutions essential for modern electronic devices.

What are some common challenges faced by professionals working in advanced packaging microelectronics, and how can they be addressed?

Professionals in Advanced Packaging Microelectronics often encounter challenges such as managing the integration of heterogeneous components, ensuring high yield in complex assembly processes, and keeping up with rapidly evolving technologies. Addressing these challenges requires strong collaboration with cross-functional teams including design, manufacturing, and quality assurance. Continuous learning and staying updated on the latest industry advancements, along with implementing robust process controls, can help professionals effectively overcome these hurdles.

Microelectronics Industrial Base Analyst with Security Clearance

Analytic Services Inc

Alexandria, VA โ€ข On-site

Other

Medical, Life

Posted 16 days ago


Job description

Company Overview: ANSER enhances national and homeland security by strengthening public institutions. We provide thought leadership for complex issues through independent analysis, and we deliver practical, useful solutions. ANSER values collaboration, integrity, and initiative and we are client focused in all that we do. Because we were established for the purpose of public service and not for profit, we measure our success in the impact of our service. Position Summary ANSER is seeking a Microelectronics Industrial Base Analyst to support the Industrial Base Analysis and Sustainment (IBAS) program within the Office of the Assistant Secretary of War for Industrial Base Policy (IBP). In this role you will assess and strengthen the U.S. and allied microelectronics industrial base, with a focus on semiconductor manufacturing, advanced packaging, trusted electronics, and supply chain resilience. You will provide strategic analysis and recommendations supporting the CHIPS and Science Act, Department of War (DoW) industrial base initiatives, and broader national security objectives while engaging stakeholders across government, industry, and academia. Work Location: This position may be performed onsite at ANSER headquarters in Arlington, VA; the Mark Center in Alexandria, VA; or via telework within the National Capital Region. This position is contingent upon contract award. Day-to-Day Responsibilities * Assess the U.S. and allied microelectronics industrial base to identify capability gaps, supply chain vulnerabilities, and opportunities to strengthen domestic manufacturing. * Evaluate industrial base risks, support investment prioritization, and develop executive-level products to inform senior government decision-making. * Analyze semiconductor ecosystems, including wafer fabrication, advanced packaging, substrates, specialty chemicals, silicon wafers, photomasks, lithography equipment, assembly, and testing capabilities. * Evaluate the impact of CHIPS and Science Act investments on domestic semiconductor capacity, supply chain resilience, and national security. * Develop strategic analyses supporting DoW Industrial Base Analysis and Sustainment (IBAS), Defense Production Act (DPA), and related industrial base initiatives. * Monitor global semiconductor market trends, foreign investment, export controls, and geopolitical risks affecting critical technologies. * Assess trusted and radiation-hardened (rad-hard) microelectronics capabilities supporting defense and space systems. * Conduct market research, cost-benefit analyses, technology readiness assessments, and other analyses to support investment prioritization. * Track key performance indicators and evaluate program outcomes against strategic objectives. * Develop and review white papers, executive briefings, congressional responses, acquisition documentation, and other products for senior government leadership. * Coordinate with government agencies, federally funded research and development centers (FFRDCs), industry partners, academic institutions, and semiconductor manufacturers. * Support technical workshops, conferences, interagency working groups, and other stakeholder engagements focused on semiconductor policy and industrial base resilience. * Apply industrial base, technology, and supply chain analysis to identify and recommend strategies for mitigating risks to critical microelectronics capabilities. Required Qualifications * Active Secret security clearance with the ability to obtain and maintain a Top Secret clearance. * Bachelor's degree in engineering, Materials Science, Physics, Electrical Engineering, Supply Chain Management, Public Policy, or a related field. * 5+ years of experience supporting semiconductors, microelectronics, defense acquisition, industrial base, or national security programs. * Demonstrated knowledge of the CHIPS and Science Act and federal semiconductor initiatives. * Experience conducting industrial base assessments, market research, and strategic analyses. * Familiarity with semiconductor manufacturing processes, including front-end fabrication, back-end assembly, advanced packaging, and testing. * Experience developing executive briefings and written products for senior government officials. * Demonstrated analytical, communication, and project management skills, including the ability to translate complex industrial base issues into clear written reports and oral presentations. * Proficiency with Microsoft Office tools, including Word, Excel, PowerPoint, and SharePoint. Preferred Qualifications * Ability to work effectively in a high-tempo, team-oriented environment and contribute to collaborative problem-solving. * Experience supporting the Office of the Secretary of War (OSW) or a comparable senior-level strategic staff environment. * Experience supporting DoW, the Department of Commerce, DARPA, or other federal agencies involved in semiconductor policy. * Knowledge of trusted microelectronics, radiation-hardened electronics, and space-qualified semiconductor technologies. * Experience conducting industrial base risk assessments, supply chain mapping, and critical technology analysis. * Familiarity with Defense Production Act authorities, Manufacturing USA Institutes, and semiconductor incentive programs. * Experience navigating the DoW acquisition lifecycle and Planning, Programming, Budgeting, and Execution (PPBE) process to identify and mitigate industrial base risks. Individual salaries are determined by a variety of factors including but not limited to: business considerations, local market, internal equity, candidate qualifications such as skills, education and experience. ANSER provides employees benefits to support all aspects of their life including health, financial and well-being. For more information, please visit: http://www.anser.org Full-Time Salary Range for this position: $119,000 - $172,000 USD In compliance with the Americans with Disabilities Act (ADA), if you have a disability and would like to request an accommodation in order to apply for a position with ANSER, please call 703-416-2000 or e-mail [email protected] ANSER is proud to be an Equal Opportunity Employer. We seek individuals from a broad variety of backgrounds with varying levels of experience who have a desire to do meaningful work. We recruit, employ, train, compensate, and promote regardless of race, color, gender, religion, national origin, ancestry, disability, age, veteran status, sexual orientation, or any other characteristic protected by law.