Phix

As a Senior Photonics Engineer specializing in Photonic IC Packaging, you are a technical leader responsible for designing, developing, and scaling advanced photonic packaging solutions. You drive innovation from concept through execution, with deep involvement in optical coupling, hybrid integration, and precision assembly processes. You act as the primary technical point of contact for customers and internal teams, lead complex development projects, and mentor engineers across disciplines and locations. Your work bridges R&D, prototyping, and early manufacturing, ensuring solutions are robust, repeatable, and manufacturable.

Responsibilities

• Lead customer technical engagement, translating system and performance requirements into packaging and assembly solutions for complex projects.
• Provide technical support to project management and commercial teams for accurate scoping, planning, and execution.
• Develop and industrialize precision optical assembly processes using structured experimentation and root‑cause analysis.
• Maintain and align process documentation and development plans, including process flows, SOPs, and work instructions.
• Lead hands‑on assembly activities in compliance with the PHIX Management System, including troubleshooting, optimization, and tooling development.
• Own assembly equipment, tooling, and metrology, ensuring 5S compliance, maintenance coordination, and correct measurement usage.
• Establish and maintain project documentation and reporting, including performance metrics, failure analyses, and lessons learned.
• Coordinate cross‑disciplinary project execution within a matrixed, international environment.
• Lead continuous improvement initiatives addressing complex, open‑ended technical challenges with measurable business impact.
• Act as a senior technical authority, mentoring engineers and serving as a knowledge resource.

Qualifications

• MSc or PhD in Photonics, Optical Engineering, Applied Physics, Electrical Engineering, Microsystems, or a related field.
• 5+ years of hands‑on experience in packaging and assembly of integrated electro‑optical, photonic, and semiconductor IC systems, including proven expertise in precision optical alignment and integration in production or pre‑production environments.
• Strong cross‑functional engineering expertise, with practical understanding of optical, mechanical, thermal, and electrical design trade‑offs.
• Experience with advanced assembly equipment and automated motion systems, supporting process development, validation, and industrialization.
• Excellent communication skills, including technical documentation, reporting, and customer‑facing interaction.
• Demonstrated ability to lead, mentor, or coordinate engineers within international or matrix organizations, with exposure to project or technical leadership.
• Familiarity with industrial development environments, including design tools (e.g. Zemax/Ansys, SolidWorks), design standards, quality systems, and manufacturing scale‑up or automation.

What we offer

• A position in the emerging field of photonic IC packaging, offering numerous exciting challenges and opportunities for personal initiative and professional growth.
• Being part of a young, dynamic and enthusiastic international team.
• Benefits include paid time off (PTO), 401k match, health insurance.
• Position is exempt from overtime.