Inlightentech

Process Development Engineer - Packaging

Location

Employment Type

Full-time

Department

About the Company

Inlighten Technologies is a Silicon Valley startup developing next-generation microLED technologies for augmented reality (AR) and AI-powered smart glasses. Our mission is to push the limits of microLED performance and manufacturing, enabling scalable, mass‑market production. Join us to help create the displays that will power the future of immersive computing.

Description

We are seeking a Process Development Engineer - Packaging, to support the development and mass production of microLED AR light engines. This role will focus on advanced packaging processes, including die bonding, interconnection, optical integration, and reliability, working closely with device, optics, and system teams to transition technologies from R&D to volume manufacturing.

Key Responsibilities

• Develop, optimize, and qualify packaging processes for microLED AR light engines.
• Lead process development for: MicroLED die bonding with FPC/PCB, Interconnect technologies, Wafer-level or panel-level packaging, Optical component integration (waveguides, collimators, micro-optics, etc.)
• Define process flows, DOEs, and control plans for new packaging technologies
• Drive yield improvement, defect reduction, and cost optimization
• Support EVT / DVT / PVT builds and ramp to mass production
• Perform failure analysis and root cause investigations related to packaging and assembly
• Collaborate with device, optics, system, equipment, and manufacturing teams
• Work with equipment vendors and material suppliers
• Generate and maintain process documentation, specifications, and qualification reports

Minimum Qualifications

• Bachelor's degree or above in Materials Science, Electrical Engineering, Mechanical Engineering, or related field
• 3-7 years of experience in advanced packaging or process development
• Strong understanding of semiconductor and optoelectronic packaging processes
• Hands‑on experience with die attach, bonding, interconnect, and assembly processes
• Experience running DOE, process characterization, and data analysis
• Familiarity with yield, reliability, and manufacturing metrics
• Ability to work in a cross-functional, fast-paced R&D-to-production environment
• Ability and willingness to travel internationally up to 20%

Preferred Qualifications

• Advanced degree (MS or PhD) in a relevant field of study.
• Direct experience with microLED, LED, or CIS packaging
• Experience in AR light engines or optical module packaging
• Familiarity with reliability testing (thermal cycling, HTOL, humidity, drop, etc.)
• Hands‑on experience with process yields analysis and defect characterization
• Salary Range: $104k - $208k/year
• Comprehensive health, dental, and vision insurance.
• Paid holidays and vacation

Inlighten Technologies is an equal opportunity employer that is committed to inclusion and diversity. We promote equal opportunity for all applicants without regard to race, color, religion, sex, gender identity, sexual orientation, national origin, disability, veteran status, or any other legally protected characteristics.