... across SoC and advanced packaging projects. Description Join our WLP team and help develop next ... Internship or research experience with a semiconductor company, OSAT, foundry, or academic ...
... across SoC and advanced packaging projects. Description Join our WLP team and help develop next ... Internship or research experience with a semiconductor company, OSAT, foundry, or academic ...
IC Packaging Engineer - WLP
$129K - $225K/yr
... across SoC and advanced packaging projects. Description Join our WLP team and help develop next ... Internship or research experience with a semiconductor company, OSAT, foundry, or academic ...
IC Packaging Engineer - WLP
$129K - $225K/yr
... across SoC and advanced packaging projects. Description Join our WLP team and help develop next ... Internship or research experience with a semiconductor company, OSAT, foundry, or academic ...
Internship Soc Overseas information
See salary details
$6.73 - $8.26
2% of jobs
$8.26 - $9.79
3% of jobs
$9.79 - $11.32
2% of jobs
$11.32 - $12.85
3% of jobs
$12.85 - $14.38
8% of jobs
$14.67 is the 25th percentile. Wages below this are outliers.
$14.38 - $15.91
32% of jobs
$15.91 - $17.44
15% of jobs
$18.73 is the 75th percentile. Wages above this are outliers.
$17.44 - $18.97
12% of jobs
$18.97 - $20.50
15% of jobs
$20.50 - $22.03
7% of jobs
$22.03 - $23.56
1% of jobs
$6
$16
$23
How much do internship soc overseas jobs pay per hour?
As of Aug 8, 2026, the average hourly pay for internship soc overseas in the United States is $16.33, according to ZipRecruiter salary data. Most workers in this role earn between $14.42 and $19.23 per hour, depending on experience, location, and employer.
What are the most commonly searched types of Soc Overseas jobs? The most popular types of Soc Overseas jobs are:
Apple rating
8.0
Based on 677 frontline employees who took The Breakroom Quiz
7th of 30 rated technology retailers
Job description
Do you like to work on groundbreaking technology? Have a passion for creating amazing products? Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical foundation and a love for excellence and precision, to help deliver extraordinary results. In this role, you will contribute to package concept exploration, support package selection and configuration studies, and grow into ownership of package integration across SoC and advanced packaging projects.
Description
Join our WLP team and help develop next-generation Wafer Level Packaging and 2.5D / 3D solutions. You'll start by supporting package concept exploration, selection and configuration studies, and prototype evaluations, while contributing to process development efforts that mature packaging solutions toward mass-production (MP) readiness on product. You'll partner with design, test, reliability, and product teams as well as foundry and OSAT partners, and grow over time into end-to-end ownership of well-scoped deliverables across characterization, modeling, and failure analysis. We're looking for a curious, detail-oriented engineer with strong fundamentals, a passion for precision, and the drive to learn quickly and solve hard problems.
Minimum Qualifications
Minimum requirement of a bachelors degree
Preferred Qualifications
MS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials, thermal, mechanical, or electrical modeling
Internship or research experience with a semiconductor company, OSAT, foundry, or academic packaging/materials lab.
Familiarity with one or more of: Wafer Level Packaging, 2.5D / 3D packaging, memory packaging, assembly processes, IC packaging materials, or reliability standards.
Exposure to materials characterization tools (SEM, EDX, CSAM, FTIR, DMA, TMA, etc.) or FA techniques, ideally on wafer level
General understanding of wafer level packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers
Ability to work independently and orchestrate projects with cross functional teams
Solution-oriented mindset with strong fundamentals in engineering physics
Good program management skills.
Description
Join our WLP team and help develop next-generation Wafer Level Packaging and 2.5D / 3D solutions. You'll start by supporting package concept exploration, selection and configuration studies, and prototype evaluations, while contributing to process development efforts that mature packaging solutions toward mass-production (MP) readiness on product. You'll partner with design, test, reliability, and product teams as well as foundry and OSAT partners, and grow over time into end-to-end ownership of well-scoped deliverables across characterization, modeling, and failure analysis. We're looking for a curious, detail-oriented engineer with strong fundamentals, a passion for precision, and the drive to learn quickly and solve hard problems.
Minimum Qualifications
Minimum requirement of a bachelors degree
Preferred Qualifications
MS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials, thermal, mechanical, or electrical modeling
Internship or research experience with a semiconductor company, OSAT, foundry, or academic packaging/materials lab.
Familiarity with one or more of: Wafer Level Packaging, 2.5D / 3D packaging, memory packaging, assembly processes, IC packaging materials, or reliability standards.
Exposure to materials characterization tools (SEM, EDX, CSAM, FTIR, DMA, TMA, etc.) or FA techniques, ideally on wafer level
General understanding of wafer level packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers
Ability to work independently and orchestrate projects with cross functional teams
Solution-oriented mindset with strong fundamentals in engineering physics
Good program management skills.
About Apple
Sourced by ZipRecruiter
Imagine what you could do here! At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, intelligent people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same real passion for innovation that goes into our products also applies to our practices strengthening our dedication to leave the world better than we found it.
Industry
Computer and electronic product manufacturing
Company size
10,000+ Employees
Headquarters location
Cupertino, CA, US
Year founded
1976