MEMS Packaging Engineer
Greater Boston area
■Development of packaging solutions for next generation Micro Electro Mechanical Systems (MEMS) inertial sensors.
■Development of Finite Element Analysis (FEA) models for simulating and predicting sensor behavior due to package influences.
■Process integration, yield improvement, design for manufacturability, & design for reliability.
■Actively interface with key US and international suppliers with the goal of developing & improving upon existing package solutions.
■Create, conduct, & analyze Design of Experiments (DOE) for development activities.
■BS/MS degree in Mechanical, Chemical, or Materials Science Engineering
■Ten years of industrial experience in the field of microelectronics and/or MEMS packaging especially in the area of Ceramic Leadless Chip Carrier (CLCC), Land Grid Array (LGA), and Chip-Scale Package (CSP) with focus on epoxy/plastic over-mold integration.
■Demonstrated experience in FEA (ANSYS preferred) modeling and implementing practical solutions for package stress reduction.
■Knowledge of fundamentals of MEMS inertial sensors – operation, characterization techniques and practical applications.
For details contact: John Visconti at firstname.lastname@example.org
or call 978-667-6680
About CAE Recruiters:
CAE Recruiters is a nationwide engineering recruitment firm specializing in engineering software development, implementation and use for over 25 years.
Careers that we focus on include:
* Design Automation and Enterprise Software Vendors. Both MCAE and EDA as well as PLM/Enterprise Software. Software Development, Sales/Marketing and Field Applications Engineering.
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* Electronic Design Engineering for all high end applications; full custom chips, ASIC, FPGA, PCB's and MEMS.
*Mechanical Engineering all applications- CFD, FEA, etc.
Posted 3 years ago
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