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Manufacturing Technician

i3 Microsystems
Saint Petersburg, FL
  • Posted: over a month ago
  • Other
Job Description

i3 Technology Group is offering entry-level opportunities at our i3 Microsystems site located in St. Petersburg, FL – where we design, manufacture, and test integrated semiconductor products for commercial customers and emerging technology programs. Join us in this exciting, high-tech production environment as a Manufacturing Technician.

i3 Microsystems, Inc. (i3M) is a leading US-based, vertically integrated supplier of secure, high-performance microsystem solutions consisting of design support and full fabrication of fan-out wafer level packaging (FO-WLP), heterogeneous system in a package (HSIP), and flip chip and surface mount (SMT) assembly within a pure-play, trusted foundry. The i3M Advanced Packaging Process Design Kit (AP-PDK) offers government, industry, and academic partners access to i3M’s proven, robust advanced microelectronics packaging technology that delivers size, weight, power, performance and cost benefits across aerospace, defense, and commercial applications.

Primary Functions:

Manufacturing Technicians perform a variety of duties to support the development, fabrication, testing, and assembly of integrated semiconductor packages. Manufacturing Technicians are responsible for the setup, operation, basic maintenance, and first-line troubleshooting for a variety of tools to support production and engineering development efforts. Manufacturing Technicians may be asked to perform tool qualifications, summarize data, prepare basic reports, and maintain data logs. Manufacturing Technicians must adhere to all safety policies and maintain a clean, orderly work area at all times. Given the diverse nature of the production needs at i3M, a Manufacturing Technician will be assigned to one or more of the following specific process areas:

  • Die Prep: De-packaging, dicing, lapping, polishing, grinding, taping, and sawing processes that are performed in advance of moving wafers to additional process steps.
  • Die Mount: Attaching one or more discrete semiconductor devices onto a waffle pack or cavity wafer to act as a transportation vehicle for additional processing.
  • Dry Etch: Removing material deposited onto wafers by using reactive ion etching (RIE) for anisotropic removal of material.
  • Metal Deposition: Metallic films are deposited onto substrates using techniques including sputter / physical vapor deposition (PVD) and electroplating.
  • Photolithography: Patterning onto the surface of a wafer by exposing a specific wavelength of light through a photo mask onto a photosensitive material spun onto the wafer surface.
  • Clean / Wet Etch: Cleaning substrates before a sensitive downstream process step or stripping undesirable films from surfaces through isotropic wet etch processes.
  • Metrology / Inspection: Monitoring of critical product specifications including film thickness, film stress, sheet resistance, particle adders, or other optical defects.
  • Electrical Test: Testing and recording electrical parameters of multi-chip modules, subsets of active circuitry, or final assembled integrated packages for the evaluation of product performance and yield.
  • Assembly: Build electronic assemblies through the use surface mount technology, screen printing, soldering, wire bonding, temperature cycling / reflow

Basic Qualifications:

  • Must possess an Associate Degree (minimum of 60 semester hours) or two years (minimum 60 semester hours) of college level study. Must possess a minimum of 12 semester hours in Science, Technology, Engineering, Mathematics, or a related field of study.
  • Candidates may substitute two years of experience working with semiconductors or circuits for every 30 semester hours of college level study.
  • Familiarity with Excel spreadsheets
  • Able to use simple hand tools
  • US Citizenship required; Must be able to obtain a US Department of Defense Secret Clearance

Preferred Qualifications:

  • Direct experience with semiconductor fabrication, working in a cleanroom environment
  • Prior knowledge of Statistical Process Control methodologies
  • Understanding of the effects of electrostatic discharge (ESD)
  • Active DoD Secret Clearance

i3 Technology Group provides a variety of benefits including health insurance coverage, life and disability insurance, a 401(k)-matching plan, company paid holidays, and paid time off. Employees are eligible for annual discretionary merit raises and bonuses designed to reward individual contributions and allow employees to share in company results.

i3 Technology Group is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, national origin, age, sex, religion, disability, sexual orientation, marital status, veteran status, gender identity or expression, or any other basis protected by local, state, or federal law. This policy applies with regard to all aspects of one’s employment, including hiring, transfer, promotion, compensation, eligibility for benefits, and termination.

i3 Microsystems

Address

Saint Petersburg, FL
33716 USA

Industry

Manufacturing

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