Req# / Job Title: 18175 Technician: Engineering Laboratory - II
Duration: 2020-01-20 to 2020-07-19
Location: Chandler, AZ
The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.
Minimum qualification is an AA degree in science or engineering and 2-4 years’ experience in failure analysis, material analysis, process development or analytical tool development.
Knowledge of packaging material property and behavior is beneficial.
Candidate should also demonstrate good communication skills, work well with a team, deliver under pressure, and well organized.
Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, and SEM imaging on printed circuit board are preferred.