Req# / Job Title: 17831 Technician: Engineering - II
Duration: 2019-10-21 to 2020-12-04
Location: Hillsboro, OR
The candidate will be responsible for conducting materials characterization and failure analysis in support of die prep technology development.
In this role you will be working directly with 3 engineers supporting the material characterization and failure analysis of die prep technology development programs
Skills/qualifications required, not limited to the following:
Top skills would be
• Optical Microscopy
• SEM (Scanning electron microscope),
• Cross-sectioning/polishing, ion mill, FIB (focused ion beam)
Must possess good communication skills, work well with a team, deliver under pressure, and be well-organized.
Basic computer skills (like Microsoft PowerPoint, Excel, Word etc)
Candidate is expected to be flexible in working in multiple labs across 2 different work sites/campuses. (Candidate will be on the work site for the full day, not driving back and forth on a day)
Minimum Education: Associate’s degree in science or engineering and 2-4 years’ experience in failure analysis, material analysis, process development, or analytical tool development.
Knowledge of wafer fabrication and die prep process is beneficial.