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Staff Packaging Engineer

Power Integrations San Jose, CA
  • Posted: August 09, 2019
  • Full-Time
Description

Staff Packaging Engineer

Job Description:

IC/Assembly package engineering, focusing on Design and Development of High voltage leaded and leadless Packages. This position also needs supporting of sustaining/manufacturing efficiency for high volume assembly.

  • Design and develop the high voltage packages with AutoCAD and Thermal simulation software
  • Work with leadframe, assembly suppliers and equipment manufacturers to develop the packages
  • Develop assembly bills of material by working with material suppliers to support product reliability and product performances
  • Develop and maintain efficient documentation system used to specify the manufacturing requirements for assembly of Power Integrations' products
  • Monitor assembly production yields, following up with assembly subcontract suppliers to address yield problems as well as opportunities for improvement
  • Coordinate projects at subcontract suppliers to reduce cost and increase productivity for Power Integrations' products
  • Occasional international travel for subcontractor support and development

Requirements:

  • Bachelor of Science in Mechanical. Electrical, Material Science. Manufacturing Engineering, or equivalent

Required and preferred qualifications include:

  • 8+ years of experience in IC assembly or package engineering role
  • Thorough knowledge of IC assembly production processes
  • Thorough knowledge of assembly materials
  • Experience with AutoCAD or other CAD systems
  • Mechanical drafting experience or training
  • Statistical Process Control (SPC) experience or training
  • Design of Experiments (D.O.E.) experience or training
  • Microsoft software experience, including Word, Excel, Outlook, Access, Powerpoint
  • Excellent communication and writing skills

Qualifications that would also be very helpful include:

  • Knowledge of materials used in semiconductor manufacturing and semiconductor assembly
  • Drafting using Geometric Dimensioning and Tolerancing (GD&T)
  • Finite Element Analysis modeling (thermal and mechanical)
  • Understanding of semiconductor reliability principles
  • Knowledge of I. C. package types used in the semiconductor industry
  • Knowledge of I.C. packing methods

Power Integrations

Address

San Jose, CA
USA

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