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Senior Engineer Field Applications

Kulicke and Soffa Phoenix, AZ
  • Expired: over a month ago. Applications are no longer accepted.
Job Description

Are you willing to make a difference?

 

Senior Engineer Fields Applications

 

At Kulicke and Soffa, (NASDAQ:KLIC) our engineers make that decision daily. We are an international leading provider of robotic semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. Meaning…medical equipment (including ventilators), cell phones, autonomous automobiles, computers, space operations …all of these use products that our equipment helps to make.

 

Job Overview

Kulicke and Soffa Industries, Inc., a leading manufacturer of semiconductor equipment, has an immediate opening for a Senior Field Applications Engineer located in the Phoenix, AZ, area.  The person will be responsible for supporting our US customers in the Advanced Packaging Business Unit.   This role encompasses 1) developing advanced packaging process solutions on K&S equipment at customer sites, 2) leading the technical interactions with the customer, 3) troubleshooting technical issues and making necessary repairs and 4) training the customer engineers in the use of the equipment.

 

The candidate should have a strong technical background and customer service experience in semiconductor packaging.  Experience with advanced packaging is a strong plus.   Demonstrated ability to working with highly advanced mechatronic machinery is required.  Strong communication skills are required.

 

While most of the customer support will be in the Greater Phoenix area, occasional support at locations in other parts of the US will be required.

 

Main Responsibilities:

Develop and optimize advanced packaging processes in collaboration with our customers

Troubleshooting and repairing of semiconductor packaging equipment

Serve as the lead technical interface to customers

Preparation of internal summary reports and customer presentations

Willingness to travel domestically about 15%, occasional international travel possible

 

Qualifications:

Strong aptitude and deep understanding of highly advanced machinery

Experience with flip chip, die attach or thermocompression bonding highly  preferred

Experience troubleshooting advanced machinery, use of oscilloscopes, etc.

Knowledge of MS Office suite, especially Excel and Power Point

 

Experience Required:

Bachelor’s Degree in Mechanical or Electrical Engineering

Minimum 5 years of experience in semiconductor packaging

 

What we have to offer: Competitive salary with bonus, 401K, innovative work environment that can offer cross functional challenging projects, variety and continual learning growth is a given not a maybe, supportive/friendly/brilliant co-workers rated highest in satisfaction from our internal employee survey.

Interested?

We began as a start-up and now 65 years later as a successful public corporation, still retain the spirit of offering our core values to employees and customers alike. With R&D centers of excellence in the USA, Europe and Asia, we bring together today’s generation of talent, collaborating on tomorrow’s technologies. For more information, please forward your resume to us.

Kulicke & Soffa is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin

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Kulicke and Soffa

Address

Phoenix, AZ
USA