Expired: over a month ago. Applications are no longer accepted.
Undergraduate Logistics & Packaging Engineering Intern Job Description If you are looking for a unique and interesting summer internship look no further. Intel's Transport Materials and Media Engineering Group is looking for a motivated summer intern. The "Transport Materials and Media Engineering Group" (TMME) is a worldwide organization that delivers shipping media and packaging solutions for all Intel products and direct materials used in our manufacturing facilities and warehouse operations. TMME is responsible for the design, development, and qualification for the shipping media's and packaging used to transport materials internally site to site and all finished products shipped to our customers. This includes wafers, bare die, finished microprocessors, solid state drives, board assemblies, and equipment related products to name a few.
Responsibilities may be quite diverse of a nonexempt technical nature. U.S. experience and education requirements will vary significantly depending on the unique needs of the job. Job assignments are usually for the summer or for short periods during breaks from school.
A successful candidate responsibilities may include:
-Designing as well as conducting test experiments to gather baseline performance data on Intel shipping media and packaging to help understand design requirements and materials necessary to protect Intel products now and in the future. -This will require working in a lab environment using packaging test equipment and metrologies such as packaged drop, vibration, unpackaged shock, accelerometer data acquisition, and data analysis using Excel and JMP statistical software. -Be involved in adhoc testing as needed to support any and all media and packaging related requests for qualifications and or package testing to help understand the design and qualification process.
A successful candidate will demonstrate: -Strong mechanical aptitude. -Strong written and verbal communication skills. -Working with Excel spreadsheets. -Excellent planning, organization, presentation, and teamwork skills. -Statistical data analysis - excel and JMP statistical software. Design of Experiments. Design Software - ArtiosCAD or similar CAD system, Solidworks or similar 3D Software. -Applicants should be hands on and not afraid to work in a Lab environment doing design of experiments on packaging and cushioning systems.
Qualifications You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through school work, classes and project work, internships, military training, and/or work experience.
This is an entry level position and compensation will be given accordingly.
Minimum Qualifications: -Must be enrolled in an accredited University either in or entering their senior year of studies and working toward a Bachelor's Degree in Packaging, Mechanical, or Industrial Engineering.
-This U.S. position is open to U.S. Workers Only. A U.S. Worker is someone who is either a U.S. Citizen, U.S. National, U.S. Lawful Permanent Resident, or a person granted Refugee or Asylum status by the U.S. Government. Intel will not sponsor a foreign national for this position.
Preferred qualifications: -Familiarity and or experience with Packaging Drop and Vibration, and Unpackaged Shock test methodologies.
Inside this Business Group As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
Other Locations US, California, Santa Clara; US, California, Folsom; US, Oregon, Hillsboro;
Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....
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