Thin Film Process Engineer
+ Warren, NJ, USA
+ Full Time
Medical, Dental, Vision, STD, LTD, Life Insurance
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MS/PhD and minimum 5 years semiconductor metallization process experience experience
Material Science, Chemical Engineering, Chemistry degree preferred. Electrical Engineering, Physics, Optical Engineering, Microelectronic engineering degrees will be considered.
Optical Engineering, Microelectronic Engineering degrees will be considered
3 -5 years of experience in GaAs/GaN IC fabrication is preferred
Demonstrate in depth knowledge of thin film metals deposition and plating processes
Familiarity with statistical methods (T- and F- tests, DOEx, control charts) is preferred
Familiarity with JMP is preferred, familiarity with all MS Office products preferred
Experience with process FMEA and 8D analysis
Strong analytical skills
1) Thin Film Eng
Maintain, improve and develop new process for GaAs and GaN metallization and plating for fabrication of semiconductor devices
Work on process and yield improvement, cost reduction and productivity improvements
Resolve manufacturing line problems
Responsible for evaluation, identification, specification and purchasing of wafer Fab processing and metrology equipment.
Responsible for ongoing development of unit wafer Fab processes.
Responsible for conducting metrology gauge R&Rs.
Responsible for characterization and optimization of capable wafer Fab processes using statistical methods (SPC).
Responsible for qualification of new wafer fab processes and changes.
Responsible for wafer fab process integration and documentation.
Responsible for training and certification of production personnel on wafer Fab processes.
Responsible for day-to-day sustaining and continuous improvement of existing wafer Fab processes.
Responsible for day-to-day yield improvement activities including leading teams to address problems and generating corrective action reports.
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