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Package Design Jobs in Oregon (NOW HIRING)

K2 Space

OR

$200K - $280K/yr

The Role We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM ...

K2 Space

OR

$180K - $260K/yr

The Role We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.

Intel

ADCE Packaging Design Architect

Hillsboro, OR

$220K - $311K/yr

Works closely with silicon and hardware teams to optimize silicon-package-board performance and pinout. Defines substrate design rules, conducts internal and external reviews, analyzes data, and ...

Nvidia

OR · Hybrid

In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical ... Optimize package pinout incorporating system level trade-offs of pins assignment. * Help perform ...

Nvidia

OR · Hybrid

In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical ... Optimize package pinout incorporating system level trade-offs of pins assignment. * Help perform ...

Intel

Silicon Packaging Design Engineer

Hillsboro, OR

$148K/yr

As a key contributor to Intel's cutting-edge technology, you will play a pivotal role in bridging silicon and hardware design, optimizing package performance, and delivering high-impact solutions ...

Nvidia

OR · On-site

$110K - $147K/yr

Experience with package design is preferred. * Good understanding of transmission line theory, power delivery and signal integrity is desired. * It is preferred to have programming and scripting ...

Sherpa Design

Mechanical Design Engineer

Portland, OR · On-site

$90K - $125K/yr

Experience designing consumer electronic products, packaging electronics, opto-mechanical product design, and precision mechanism design * Experience with machine design and robotic automation

Sherpa Design

Mechanical Design Engineer

Portland, OR · On-site

Experience designing consumer electronic products, packaging electronics, opto-mechanical product design, and precision mechanism design * Experience with machine design and robotic automation

Sherpa Design

Mechanical Design Engineer

Portland, OR

$80K - $109K/yr

Experience designing consumer electronic products, packaging electronics, opto-mechanical product design, and precision mechanism design * Experience with machine design and robotic automation

ISAT Total Support

Design Engineer

Portland, OR · On-site

You will be responsible for preparing custom engineering packages, providing technical support ... This role blends engineering design, project coordination, technical communication, and product ...

Thermal Works

OR · On-site

Establish and enforce design phase gates, deliverables, and review checkpoints; ensure every package meets ThermalWorks technical standards and customer requirements before release. * Serve as the ...

Travere

OR · On-site

$15 - $18.50/hr

Packaging Design and Development * Lead the development and finalization of packaging configurations, including primary packaging, labels, cartons, shippers, and ancillary components. * Oversee the ...

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All JobsPackage Design JobsPackage Design Jobs in Oregon

Package Design information

See Oregon salary details

$10

$18

$25

How much do package design jobs pay per hour?

As of Jun 9, 2026, the average hourly pay for package design in Oregon is $19.00, according to ZipRecruiter salary data. Most workers in this role earn between $16.78 and $19.81 per hour, depending on experience, location, and employer.

What does a package designer do?

A package designer creates the visual and structural design of product packaging to attract consumers and communicate brand identity. They use graphic design tools and knowledge of materials to develop functional, appealing packaging that meets safety and regulatory standards. The role often involves collaboration with marketing, product development, and manufacturing teams.

What is the difference between Package Design vs Graphic Designer?

AspectPackage DesignGraphic Designer
CredentialsDesign degree or related certificationDesign degree or related certification
Work EnvironmentPackaging companies, branding agencies, manufacturingAdvertising agencies, media companies, freelance
Industry UsageProduct packaging, branding, retailMarketing materials, digital media, branding

Package Design focuses on creating packaging solutions for products, emphasizing structural and visual aspects of packaging. Graphic Designers work on visual content across various media, including branding, advertising, and digital design. While both roles require design skills and similar credentials, Package Designers specialize in packaging materials and structures, whereas Graphic Designers have a broader scope in visual communication across multiple platforms.

What cities in Oregon are hiring for Package Design jobs? Cities in Oregon with the most Package Design job openings:
Package Design jobs near you
Infographic showing various Package Design job openings in Oregon as of June 2026, with employment types broken down into 1% As Needed, 76% Full Time, 20% Part Time, 2% Contract, and 1% Nights. Highlights an 86% Physical, 4% Hybrid, and 10% Remote job distribution, with an average salary of $39,515 per year, or $19 per hour.

Principal ASIC Package Design Engineer

K2 Space

OR

$200K - $280K/yr

Other

Medical, Dental, Vision, Life, PTO

Posted 25 days ago

Job description

The Role

We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions. This role owns the end-to-end package strategy for high-performance mixed-signal and digital SoCs from early architecture and trade studies through vendor engagement, qualification, and production ramp. You will operate as the technical authority for package design, defining standards, influencing silicon and system architecture, and ensuring first-pass success for complex, high-speed, power-dense ASICs.

Responsibilities

  • Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.
  • Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability.
  • Define long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die integration.
  • Establish organizational package design standards, methodologies, and best practices.
  • Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content.
  • Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning.
  • Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces.
  • Own package-level SI/PI strategy, including high-speed digital interfaces (e.g., SerDes, JESD, Interlaken), power delivery network (PDN) design, and decoupling strategy
  • Lead thermal architecture at the package level, including lid selection, TIMs, heat-spreaders, and mechanical interfaces to system cooling.
  • Serve as the primary technical interface to substrate vendors, assembly houses, and OSATs.
  • Drive material selection, substrate technology choices, and assembly process optimization.

Qualifications 

  • Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
  • 10+ years of experience in ASIC package design, with deep expertise in FC-BGA.
  • Proven experience delivering high-pin-count, high-performance ASIC packages into production.
  • Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs.
  • Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS.
  • Experience working directly with OSATs and substrate vendors.
  • Knowledge of packaging qualification and test methodologies.

Nice to Have

  • Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates).
  • Background in high-speed digital or mixed-signal SoCs.
  • Familiarity with aerospace, space, or high-reliability electronics.
  • Experience defining packaging strategy from early architecture through first silicon and volume ramp.
  • Demonstrated history of building or scaling package design methodology within an organization.

Compensation and Benefits:

  • Base salary range for this role is $200,000 - $280,000 + equity in the company
  • Salary will be based on several factors including, but not limited to: knowledge and skills, education, and experience level
  • Comprehensive benefits package including paid time off, medical/dental/vision/ coverage, life insurance, paid parental leave, and many other perks

About K2 Space

Sourced by ZipRecruiter

Industry

Guided missile and space vehicle manufacturing

Company size

11 - 50 Employees

Headquarters location

Los Angeles, CA, US

Year founded

2022

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